Galaxy Z Flip FE & Z Flip 7 tipped to use different Exynos chips

Samsung’s next-gen foldable phones are still many months away from arriving. However, early leaks have revealed an interesting detail about their potential chipsets. According to` a new report, the Galaxy Z Flip FE and Z Flip 7 will use Exynos chips, but not the same model.

Yesterday, a tipster teased that we could see Exynos hardware in all of Samsung’s 2025 foldables. The report pointed to the potential implementation of the Exynos 2500 chip in all models. However, a new source sheds more light on the matter for two of the upcoming Z Flip and Fold devices.

Different Exynos chip models for the Galaxy Z Flip FE and Z Flip 7, tipster claims

According to tipster Jukanlosreve, the Samsung Galaxy Z Flip FE will not use the 3nm Exynos 2500 but the 4nm Exynos 2400e. The latter, produced using the IPoP packaging technique, is present in the Galaxy S24 FE. This chip is marginally less powerful than the original Exynos 2400, which powers the Galaxy S25 series. This makes sense considering that the Galaxy Z Flip FE will be Samsung’s most affordable foldable to date. Anyway, the hardware has shown good performance.

… also asserts that the 3nm Exynos 2500 chip will power the standard Galaxy Z Flip 7. The South Korean giant hopes to achieve better yield rates on its 3nm wafers in the coming months, enabling them to produce more usable units of the SoC. The tipster also refutes some rumors suggesting that Samsung will utilize an Exynos 2400 chip in the Galaxy Z Flip 7. Considering that the current Galaxy Z Flip 6 uses the Snapdragon 8 Gen 3, such a decision would not make sense.

The leaks surrounding the Exynos 2500 speak of a powerful and efficient chip. However, Samsung Foundry has not been up to the task when it comes to mass-producing it. The hardware’s CPU could have 3x Cortex-X925 cores, 5x Cortex-A725 cores, and 2x Cortex-A520 cores. Lastly, it could integrate an Xclipse 950 GPU for heavy mobile gaming.