WATCH THE VIDEO HERE MediaTek has introduced Dimensity 6300 SoC in the Dimensity 6000 series after the launch of Dimensity 6100+ last year. It integrates an enhanced 5G modem supporting 3GPP Release 16 standard with up to 140MHz 2CC 5G Carrier Aggregation and has MediaTek UltraSave 3.0+ technology for power saving, same as the 6100+. The chip has two Arm Cortex-A76 big cores clocked at 2.4GHz and six Arm Cortex-A55 efficiency cores, clocked at 2GHz. It promises up to 10% faster CPU performance than the previous generation, and over 50% GPU performance. The first smartphone powered by Dimensity 6300 SoC is expected to be realme C65 5G, which should launch in India later this month, followed by other markets.
Processor
Dimensity 6300
Dimensity 6100+
Dimensity 6020
Process
TSMC N6 (6nm-class)
CPU
2x Cortex-A76 @ 2.4GHz 6x Cortex-A55 @ 2GHz
2x Cortex-A76 @ 2.2GHz 6x Cortex-A55 @ 2GHz
2x Cortex-A76 @ 2.4GHz 6x Cortex-A55 @ 2GHz
Memory
LPDDR4x 2133MHz, UFS 2.2 (2-lane)
Camera
16MP+16MP, 108MP,Hardware MFNR, 3DNR, AI-FD
Display
2520 x 1080 (Full HD+) at 21:9 120Hz
Video Decode / Video Encode
2160p (2160 x 1080), h.264, h.265 / HEVC 4K 30fps
Graphics
Arm Mali-G57 MC2
Modem
2G / 3G / 4G / 5G Multi-Mode, 4G Carrier Aggregation (CA), 5G Carrier Aggregation (CA), EDGE, 4G FDD / TDD, 5G FDD / TDD, GSM, TD-SCDMA, WDCDMA
Connectivity
Integrated Dual-Band Wi-Fi 5 (a/b/g/n/ac), Bluetooth 5.2, GPS L1CA+L5 BeiDou B1I+ B2a Glonass L1OF Galileo E1 + E5a QZSS L1CA+ L5 NavIC
Availability