Samsung brings backside power delivery to its 2nm chips

Samsung’s chip division, aka Samsung Foundry, is coming up with an innovative method to manufacture chips with smaller node sizes. As per a report by the Korean website Chosun Biz, Samsung Foundry plans to bring Backside Power Delivery Network (BSPDN) technology to its 2nm chips.

The chip race between semiconductor manufacturers is heating up with 2nm chips. These chips are mainly scheduled for smartphones to launch in 2025. By decreasing the nanometer count, manufacturers can place more transistors into chips, making them more powerful and enhancing their power efficiency.

Samsung’s 2nm chips land with Backside Power Delivery Network (BSPDN)

The Backside Power Delivery Network (BSPDN) is a technology that basically routes power supply lines on the backside of a chip and removes power-delivering interconnects beneath the silicon. This implementation creates space for the data interconnects above the silicon and allows manufacturers to build larger, less resistive power interconnects.

By implementing BSPDN, Samsung Foundry can reduce interference between power lines and simplify the production process. Additionally, smaller node sizes can potentially enhance the power and efficiency of Samsung’s 2nm chips.

Samsung Foundry reportedly began testing BSPDN into two Arm chips, leading to a 10% and 19% reduction in die sizes and a 9% increase in performance and efficiency. The Korean outlet asserts that the test results were beyond Samsung’s expectations.

Intel and TSMC are also preparing their 2nm chips

Samsung initially planned to launch BSPDN with its 1.7nm chips. However, its roadmap indicates that the 2nm chips are the first to receive BSPDN. The chips will enter production in 2025. Japan’s Preferred Networks (PFN) and Qualcomm are said to be the first customers of Samsung’s 2nm chips. Qualcomm Snapdragon 8 Gen 5, which powers flagship Galaxy devices, relies on Samsung’s in-house SF2P process.

As we earlier reported, Apple has started designing its chips based on TSMC’s 2nm fabrication process. The chips are expected to land in the 2025 iPhone 17 series. Intel’s 2nm chips, dubbed Intel 20A, also enter production this year.